HEAD FOR INJECTING REACTIVE GAS FOR FILM FORMATION AND METHOD FOR MANUFACTURING SAME

Title:

HEAD FOR INJECTING REACTIVE GAS FOR FILM FORMATION AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2024/029379

Kind Code:

A1

Abstract:

This method for manufacturing a head includes diffusion-bonding a first plate and a second plate to each other, and after the diffusion bonding, forming a nickel-containing film by electroless plating on the surfaces of the first plate and the second plate. The first plate and the second plate are configured so as to have, in the bonded state, a channel through which a reactive gas passes from the first plate side to the second plate side.

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Inventors:

ARAKI YOSHIHITO (JP)
KANEDA NORIYOSHI (JP)

Application Number:

PCT/JP2023/026927

Publication Date:

February 08, 2024

Filing Date:

July 24, 2023

Export Citation:

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Assignee:

NHK SPRING CO LTD (JP)

International Classes:

C23C16/455

Domestic Patent References:

WO2010010956A1

2010-01-28

Foreign References:

JP2008031558A	2008-02-14
JP2019220639A	2019-12-26
US20130052804A1	2013-02-28
JP2019220589A	2019-12-26
US20060283921A1	2006-12-21
JP2016164994A	2016-09-08