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Patent Searching and Data


Title:
HEAD MODULE SUPPORT MECHANISM, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/139984
Kind Code:
A1
Abstract:
Provided are a head module support mechanism, a liquid discharge head, and a liquid discharge system, with all of which it is possible to ensure a prescribed positional accuracy in movement of a head module. A head module support mechanism (36) is for supporting a head module in a liquid discharge head equipped with one or more head modules, and comprises: a fixed part (42) that is joined to a frame of the liquid discharge head; a movement part (40) which supports the head module and which is supported movably in a first direction with respect to the fixed part; and a first-direction movement part which moves, in the first direction with respect to the fixed part, the movement part supporting the head module; and a guide part which guides the movement part with respect to the fixed part and which has applied thereto a rolling guide (200) that extends in the first direction.

Inventors:
KOGA TAKEHIKO (JP)
Application Number:
PCT/JP2022/045976
Publication Date:
July 27, 2023
Filing Date:
December 14, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B41J2/01
Domestic Patent References:
WO2020196622A12020-10-01
WO2020116519A12020-06-11
Foreign References:
JPH11348248A1999-12-21
JP2014198451A2014-10-23
JPS6132621U1986-02-27
JP2003148485A2003-05-21
JP2006091616A2006-04-06
JP2014188985A2014-10-06
JP2019147390A2019-09-05
JP2012125986A2012-07-05
JP2018114722A2018-07-26
JP2019162867A2019-09-26
JP2018079582A2018-05-24
US9227444B12016-01-05
US20150022588A12015-01-22
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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