HEADSET INCLUDING IN-EAR MICROPHONE

WIPO Patent Application WO/2020/153666

A1

Disclosed is a headset including an in-ear microphone, the headset comprising: a first frame which includes a first surface oriented in a first direction, a second surface oriented in a second direction opposite to the first direction, and a side surface surrounding at least a portion of a space between the first surface and the second surface; a speaker seating part which is recessed a predetermined depth toward the second surface from a first portion of the first surface; a space which is formed between the speaker seating part and the second surface; a speaker hole which passes through from the speaker seating part to the space; a microphone hole which passes through from a second portion of the first surface to the space; a sound hole which is formed passing through from the space to the second surface; a speaker which is seated in the speaker seating part; a first printed circuit board which is disposed on the second portion and has a via-hole connected to the microphone hole; a second printed circuit board which is electrically connected to the first printed circuit board and a connection portion of the speaker; and a microphone which is mounted on the first printed circuit board at a position aligned with the via-hole. Various other embodiments that can be understood through the present document are also possible.

PARK HAEKEU (KR)
YOON KYEONGCHEOL (KR)
JEONG HYEONYEONG (KR)
CHO SUNGHOON (KR)
KIM SEONMI (KR)
LEE JEOCK (KR)
KWON SEYOUN (KR)

PCT/KR2020/000847

July 30, 2020

January 17, 2020

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SAMSUNG ELECTRONICS CO LTD (KR)

H04R1/28; H04R1/10; H05K1/11

JP2015089011A	2015-05-07
KR20170030375A	2017-03-17
KR20130110332A	2013-10-10
US20100215198A1	2010-08-26
JP2005277792A	2005-10-06

See also references of EP 3902284A4

KWON, Hyuk-Rok et al. (KR)

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