HEAT-BONDING DEVICE AND HEAT-BONDED-ARTICLE MANUFACTURING METHOD

WIPO Patent Application WO/2014/115583

A1

Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when performing a heat-bonding process in a vacuum, e.g. soldering, the temperatures of target objects being heat-bonded can be brought to a prescribed target temperature suitable for heat-bonding, in less time than with conventional devices and methods, without overshooting said target temperature by a large amount. This heat-bonding device is provided with the following: a vacuum chamber that contains the target objects to be heat-bonded and a buffer part; a heater that heats the buffer part, which is disposed so as to contact the target objects in the vacuum chamber; a cooler that removes some of the heat from the buffer part heated by the heater; a target-object temperature sensor that detects the temperatures of the target objects, which are heated via the buffer part; and a control device that controls the heat-bonding device by regulating the removal of heat from the buffer part by the cooler on the basis of the detected temperatures of the target objects so as to bring the temperatures of the target objects to the abovementioned target temperature suitable for heat-bonding.

MATSUDA JUN (JP)
SUZUKI TAKAYUKI (JP)
KURODA MASAMI (JP)

PCT/JP2014/050239

July 31, 2014

January 09, 2014

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ORIGIN ELECTRIC (JP)

H05K3/34; B23K1/00; B23K1/008; B23K3/04; B23K101/42

JP2006082112A	2006-03-30
JP2004290993A	2004-10-21
JP2010267769A	2010-11-25
JP2003297860A	2003-10-17
JP2001308511A	2001-11-02
JP2010125486A	2010-06-10
JPH11233934A	1999-08-27

See also references of EP 2950622A4

MIYAGAWA, Teiji et al. (JP)
Teiji Miyagawa (JP)

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