HEAT-BONDING DEVICE AND HEAT-BONDED-ARTICLE MANUFACTURING METHOD

WIPO Patent Application WO/2014/115584

A1

Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when cooling a workpiece after performing heat-bonding in a vacuum, target objects that were heat-bonded can be cooled in less time than with conventional devices and methods, without overheating the target objects. This heat-bonding device is provided with the following: a vacuum chamber (10) that contains the target objects (1) being heat-bonded and a buffer part (5); a heater (20) that heats the buffer part, which is disposed so as to contact the target objects in the vacuum chamber; a target-object temperature sensor (40) that detects the temperatures of the target objects, which are heated via the buffer part; a buffer temperature sensor (60) that detects the temperature of the buffer part; a vacuum breaker (70) that breaks the vacuum inside the vacuum chamber; and a control device (50) that activates the vacuum breaker, breaking the vacuum inside the vacuum chamber, if the difference between the temperatures detected by the target-object temperature sensor and the buffer temperature sensor falls to within a prescribed temperature-difference range.

JPH0570757	[Name of device] Solder reflow device
JP2007303760	BAKING TRAY FOR CONVECTION HEATING
JP2001170767	SOLDERING APPARATUS

MATSUDA JUN (JP)
SUZUKI TAKAYUKI (JP)
KURODA MASAMI (JP)

PCT/JP2014/050240

July 31, 2014

January 09, 2014

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ORIGIN ELECTRIC (JP)

B23K1/008; B23K1/00; B23K3/04; H05K3/34; B23K101/42

WO2013161875A1	2013-10-31
WO2009090808A1	2009-07-23
WO2009022590A1	2009-02-19

JP2010125486A	2010-06-10
JPH11233934A	1999-08-27

See also references of EP 2949415A4

MIYAGAWA, Teiji et al. (JP)
Teiji Miyagawa (JP)

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