Title:
HEAT-CONDUCTIVE COMPOSITION, HEAT-CONDUCTIVE MEMBER, AND BATTERY MODULE
Document Type and Number:
WIPO Patent Application WO/2020/213306
Kind Code:
A1
Abstract:
Provided is a heat-conductive member which has excellent adhesion performance and is hardly detached from an object having the heat-conductive member adhered thereto even when vibrations or the like are applied repeatedly. A heat-conductive composition comprising a curable organopolysiloxane (A), an alkoxysilane compound (B) and a heat-conductive filler (C), wherein the alkoxysilane compound (B) is an alkoxysilane containing a long-chain alkenyl group.
Inventors:
UMETANI HIROSHI (JP)
ISHIDA KEITA (JP)
ISHIDA KEITA (JP)
Application Number:
PCT/JP2020/010511
Publication Date:
October 22, 2020
Filing Date:
March 11, 2020
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L83/04; C08K5/5425; C08L83/05; C08L83/07; C09K5/14; H01M2/10; H01M10/613; H01M10/625; H01M10/651; H01M10/653; H01M10/6567
Domestic Patent References:
| WO2018173860A1 | 2018-09-27 | |||
| WO2018173860A1 | 2018-09-27 |
Foreign References:
| CN107043541A | 2017-08-15 |
Other References:
See also references of EP 3957688A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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