Title:
HEAT-CONDUCTIVE SHEET AND HEAT-CONDUCTIVE SHEET PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/181171
Kind Code:
A1
Abstract:
The present invention provides a heat-conductive sheet exhibiting excellent restoring force when subjected to compression and release. In a heat-conductive sheet 1, a fibrous filler 3 is dispersed in a binder resin 2 and the fibrous filler 3 is disposed at an angle of 70-90 degrees in a thickness direction B in a cross-sectional view. If the heat-conductive sheet 1 is subjected to compression and release under the following condition 1, the angle of the fibrous filler 3 after release is in the range of within 10 degrees of the angle before compression in a cross-sectional view. Condition 1: Release after the thickness of the heat-conductive sheet 1 has been compressed 40% compared to the initial thickness for 24 hours at room temperature.
Inventors:
TOBATA MARINA (JP)
ARAMAKI KEISUKE (JP)
ARAMAKI KEISUKE (JP)
Application Number:
PCT/JP2022/003008
Publication Date:
September 01, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/36; B29D7/01; C08J5/18; C08K3/22; C08K7/06; C08L83/04; C08L101/00; H01L23/373; H05K7/20
Domestic Patent References:
| WO2020153377A1 | 2020-07-30 |
Foreign References:
| JP6817408B1 | 2021-01-20 | |||
| JP2020013870A | 2020-01-23 | |||
| JP2017175080A | 2017-09-28 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro et al. (JP)
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