Title:
HEAT TRANSFER SHEET AND PRODUCTION METHOD FOR HEAT TRANSFER SHEET
Document Type and Number:
WIPO Patent Application WO/2022/181172
Kind Code:
A1
Abstract:
Provided is a heat transfer sheet that is not susceptible to containing air during mounting and that is capable of reducing a thermal resistance difference due to a load. The heat transfer sheet 1 has a surface arithmetic mean roughness (Sa) of at least 5.0 μm, and a thermal resistance difference between the thermal resistance of 1 kgf/cm2 at a thickness of 0. 3 mm and the thermal resistance of 5 kgf/cm2 at a thickness of 0. 3 mm is less than 0.10°C·cm2/W.
Inventors:
TOBATA MARINA (JP)
ARAMAKI KEISUKE (JP)
ARAMAKI KEISUKE (JP)
Application Number:
PCT/JP2022/003009
Publication Date:
September 01, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/373; B29C59/02; B29D7/01; C08J5/18; H01L23/36; H05K7/20
Domestic Patent References:
WO2017145957A1 | 2017-08-31 | |||
WO2011158942A1 | 2011-12-22 |
Foreign References:
JP2015035580A | 2015-02-19 | |||
JP2014027144A | 2014-02-06 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro et al. (JP)
Download PDF: