Title:
HEAT-CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/004150
Kind Code:
A1
Abstract:
This heat-conductive sheet comprises: a matrix composed of an organopolysiloxane having a cross-linked structure; a heat-conductive filler dispersed in the matrix; and a silicon compound. The silicon compound is at least one selected from alkoxysilane compounds and alkoxysiloxane compounds.
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Inventors:
KUDOH HIROKI (JP)
Application Number:
PCT/JP2018/024062
Publication Date:
January 03, 2019
Filing Date:
June 25, 2018
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08K3/013; C09K5/14; C08K5/541; C08L83/04; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
WO2014196347A1 | 2014-12-11 |
Foreign References:
JP2009209165A | 2009-09-17 | |||
JP2015233104A | 2015-12-24 | |||
JP2005112961A | 2005-04-28 | |||
JP2002003718A | 2002-01-09 | |||
JPH08295737A | 1996-11-12 | |||
JP2005146057A | 2005-06-09 |
Other References:
See also references of EP 3608384A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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