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Patent Searching and Data


Title:
HEAT-CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/004150
Kind Code:
A1
Abstract:
This heat-conductive sheet comprises: a matrix composed of an organopolysiloxane having a cross-linked structure; a heat-conductive filler dispersed in the matrix; and a silicon compound. The silicon compound is at least one selected from alkoxysilane compounds and alkoxysiloxane compounds.

Inventors:
KUDOH HIROKI (JP)
Application Number:
PCT/JP2018/024062
Publication Date:
January 03, 2019
Filing Date:
June 25, 2018
Export Citation:
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Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08K3/013; C09K5/14; C08K5/541; C08L83/04; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
WO2014196347A12014-12-11
Foreign References:
JP2009209165A2009-09-17
JP2015233104A2015-12-24
JP2005112961A2005-04-28
JP2002003718A2002-01-09
JPH08295737A1996-11-12
JP2005146057A2005-06-09
Other References:
See also references of EP 3608384A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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