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Title:
HEAT-CONDUCTIVE SILICONE COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/276846
Kind Code:
A1
Abstract:
Provided is a heat-conductive silicone composition exhibiting a good heat radiation effect.　The heat-conductive silicone composition contains the following components (A), (B), (C), (D) and (E): (A) An organopolysiloxane having a kinematic viscosity at 25 °C of 10-100,000 mm2/s and containing at least two alkenyl groups bonded to silicon atoms in a single molecule; (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms (SiH groups) bonded to silicon atoms in a single molecule; (C) a hydrosilylation reaction catalyst; (D) silver powder having a tap density of 3.0 g/cm3 or more, a specific surface area of 2.0 m2/g or less, and an aspect ratio of 2.0-50; and (E) spherical silver powder having an average particle diameter of 0.5-100 µm, a tap density of 4.0 g/cm3 or more, a specific surface area of 1.5 m2/g or less, and an aspect ratio of less than 2.0.

Inventors:
AKIBA SHOTA (JP)
Application Number:
PCT/JP2022/025063
Publication Date:
January 05, 2023
Filing Date:
June 23, 2022
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/08
Domestic Patent References:
WO2017159252A12017-09-21
WO2020241054A12020-12-03
WO2018079362A12018-05-03
WO2020137332A12020-07-02
WO2020129555A12020-06-25
Foreign References:
JP2018058953A2018-04-12
JP2017066406A2017-04-06
JP2021098768A2021-07-01
JP2016509086A2016-03-24
JPH02153995A1990-06-13
JPH0314873A1991-01-23
JPH10110179A1998-04-28
JP63872A1971-12-30
JP2002030217A2002-01-31
JP2000063873A2000-02-29
JP2008222776A2008-09-25
JP3130193B22001-01-31
JP3677671B22005-08-03
JP2000063872A2000-02-29
Attorney, Agent or Firm:
USHIKI & ASSOCIATES (JP)
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