Title:
HEAT-CURABLE AND PHOTOCURABLE SILICONE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/070199
Kind Code:
A1
Abstract:
This heat-curable and photocurable silicone composition comprises: (A) an organopolysiloxane having at least three (meth)acrylic groups per molecule; (B) an organopolysiloxane having at least two alkenyl groups per molecule and having no (meth)acrylic group; (C) an organohydrogen polysiloxane having at least two hydrosilyl groups per molecule; (D) a hydrosilylation reaction catalyst; and (E) a photopolymerization initiator, wherein the ratio of the number of (meth)acrylic groups in the component (A) to the number of alkenyl groups in the composition is 0.9-3.0, and the ratio of the number of hydrosilyl groups to the number of alkenyl groups is 0.8-1.2. The heat-curable and photocurable silicone composition makes it possible to easily manage a first stage of curing and a second stage of curing separately.
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Inventors:
TOYOSHIMA TAKEHARU (JP)
OZAI TOSHIYUKI (JP)
OZAI TOSHIYUKI (JP)
Application Number:
PCT/JP2023/028117
Publication Date:
April 04, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08F2/50; C08F290/06; C08L83/05
Domestic Patent References:
| WO2020145178A1 | 2020-07-16 | |||
| WO2020004254A1 | 2020-01-02 | |||
| WO2020145151A1 | 2020-07-16 | |||
| WO2018079678A1 | 2018-05-03 | |||
| WO2022215601A1 | 2022-10-13 |
Foreign References:
| JPH09296113A | 1997-11-18 | |||
| JP2016210861A | 2016-12-15 | |||
| JP2021501813A | 2021-01-21 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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