Title:
PHOTO- AND HEAT-CURABLE SILICONE COMPOSITION AND PRODUCTION METHOD FOR CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/070200
Kind Code:
A1
Abstract:
A silicone composition contains (A) an organopolysiloxane having at least three (meth)acrylic groups in one molecule, (B) an organopolysiloxane having at least two alkenyl groups in one molecule and not having a (meth)acrylic group, (C) an organohydrogenpolysiloxane having at least two hydrosilyl groups in one molecule, (D) a photopolymerization initiator, and (E) a hydrosilylation reaction catalyst, wherein: the content of the (meth)acrylic groups contained in the (A) component is 1-15 mmol in 100 g of the composition; the ratio of the number of the alkenyl groups in the composition/the number of the (meth)acrylic groups contained in the (A) component is at least 0.5; and the ratio of the number of the hydrosilyl groups/the number of the alkenyl groups and (meth)acrylic groups contained in the (A) and (B) components is 0.8-3.0. This silicone composition makes it possible to individually and simply manage curing at a first stage and curing at a second stage.
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Inventors:
TOYOSHIMA TAKEHARU (JP)
OZAI TOSHIYUKI (JP)
OZAI TOSHIYUKI (JP)
Application Number:
PCT/JP2023/028118
Publication Date:
April 04, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08F2/50; C08F290/06; C08L83/05
Domestic Patent References:
| WO2020145178A1 | 2020-07-16 | |||
| WO2020004254A1 | 2020-01-02 | |||
| WO2020145151A1 | 2020-07-16 | |||
| WO2018079678A1 | 2018-05-03 | |||
| WO2022215601A1 | 2022-10-13 |
Foreign References:
| JPH09296113A | 1997-11-18 | |||
| JP2016210861A | 2016-12-15 | |||
| JP2021501813A | 2021-01-21 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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