Title:
HEAT-CURABLE RESIN, COMPOSITION, UNCURED MOLDED OBJECT, PARTLY CURED MOLDED OBJECT, CURED MOLDED OBJECT, AND METHOD FOR PRODUCING HEAT-CURABLE RESIN
Document Type and Number:
WIPO Patent Application WO/2023/063334
Kind Code:
A1
Abstract:
Provided are: a benzoxazine-based resin which, before curing, has excellent flexibility and/or which is excellent in terms of decomposition temperature and toughness before and after curing; and a method for producing the benzoxazine-based resin. The heat-curable resin according to one aspect of the present invention is a heat-curable resin having a main chain including a benzoxazine ring structure, the heat-curable resin having an aromatic group derived from a bifunctional phenol compound (A) and a linear alkylene group derived from an aliphatic diamine compound (B) and optionally having a (poly)oxyalkylene group derived from a (poly)oxyalkylenediamine compound (C).
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Inventors:
YAMAMOTO HIDEKI (JP)
Application Number:
PCT/JP2022/037971
Publication Date:
April 20, 2023
Filing Date:
October 12, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G14/073; B29C70/06; C08J5/24
Domestic Patent References:
| WO2009017218A1 | 2009-02-05 |
Foreign References:
| JP2010053324A | 2010-03-11 | |||
| JP2010053325A | 2010-03-11 | |||
| JP2007154018A | 2007-06-21 | |||
| JP2008291070A | 2008-12-04 | |||
| JP2022053324A | 2022-04-05 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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