Title:
HEAT DIFFUSION DEVICE AND ELECTRONIC APPLIANCE
Document Type and Number:
WIPO Patent Application WO/2023/238626
Kind Code:
A1
Abstract:
A vapor chamber 1 as an embodiment of this heat diffusion device comprises: a housing 10 having a first inner surface 11a and a second inner surface 12a, which face each other in the thickness direction Z; a working fluid 20 enclosed in the inner space of the housing 10; and a wick 30 disposed in the inner space of the housing 10, the wick 30 including a support 31 which is in contact with the first inner surface 11a and a perforated object 32 which is in contact with the support 31, the edges of the wick 30 being bent so as to approach the first inner surface 11a.
Inventors:
OHITSU TOSHIKATSU (JP)
Application Number:
PCT/JP2023/018557
Publication Date:
December 14, 2023
Filing Date:
May 18, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
F28D15/04; F28D15/02; H01L23/427; H05K7/20
Foreign References:
| US20200182557A1 | 2020-06-11 | |||
| US20210293488A1 | 2021-09-23 | |||
| US20110168359A1 | 2011-07-14 | |||
| JP2019113270A | 2019-07-11 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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