Title:
HEAT SPREADING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/238625
Kind Code:
A1
Abstract:
Provided is a vapor chamber 1 which is one embodiment of a heat spreading device, the vapor chamber comprising: a housing 10 that includes a first inner surface 11a and a second inner surface 12a which face each other in the thickness direction Z; a working medium 20 that is sealed in an internal space of the housing 10; and a wick 30 that is disposed in the internal space of the housing 10. The wick 30 includes: a support body 31 that adjoins the first inner surface 11a; and a porous body 32 that adjoins the support body 31. An edge of the wick 30 is curved towards the second inner surface 12a so as to approach the same.
Inventors:
NUMOTO TATSUHIRO (JP)
MORIKAMI MASASHI (JP)
MORIKAMI MASASHI (JP)
Application Number:
PCT/JP2023/018555
Publication Date:
December 14, 2023
Filing Date:
May 18, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
F28D15/04; F28D15/02; H01L23/427; H05K7/20
Domestic Patent References:
| WO2020026908A1 | 2020-02-06 |
Foreign References:
| CN214502178U | 2021-10-26 | |||
| US20110168359A1 | 2011-07-14 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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