Title:
HEAT DISSIPATING STRUCTURE, METHOD FOR MANUFACTURING HEAT DISSIPATING STRUCTURE, AND BATTERY
Document Type and Number:
WIPO Patent Application WO/2019/244881
Kind Code:
A1
Abstract:
[Problem]
To provide a heat dissipating structure which is less dependent on irregularities in the surface of a heat source, which has a large surface area of contact with the heat source, with which it is possible to obtain a high heat dissipation efficiency, and with which the weight of the heat dissipating structure can be reduced, a method for manufacturing the same, and a battery provided with the heat dissipating structure.
[Solution]
The present invention relates to a heat dissipating structure 1 for enhancing heat dissipation from a heat source, a method for manufacturing the heat dissipating structure, and a battery 20, wherein the heat dissipating structure 1 is provided with a first sheet 2, one or a plurality of second sheets 3 which are fixed to at least one surface of the first sheet 2, and which are capable of forming spaces 4 between the first sheet 2 and the second sheets, and resilient members 6 disposed in the spaces 4.
Inventors:
IGUCHI YUKA (JP)
KUWABARA TOMOHIKO (JP)
FURUYA TOSHITSUGU (JP)
KUWABARA TOMOHIKO (JP)
FURUYA TOSHITSUGU (JP)
Application Number:
PCT/JP2019/024081
Publication Date:
December 26, 2019
Filing Date:
June 18, 2019
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
G12B15/06; H01L23/36; H01M10/613; H01M10/623; H01M10/625; H01M10/655; H01M10/6551; H01M10/6554; H01M10/6556; H01M10/6568; H01M50/209; H05K7/20
Domestic Patent References:
| WO2014185271A1 | 2014-11-20 |
Foreign References:
| JP2000236050A | 2000-08-29 | |||
| JP2017195018A | 2017-10-26 |
Attorney, Agent or Firm:
MEBUKI IP LAW FIRM et al. (JP)
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