Title:
HEAT DISSIPATION STRUCTURE, HEAT DISSIPATION STRUCTURE PRODUCTION METHOD, AND BATTERY
Document Type and Number:
WIPO Patent Application WO/2019/244882
Kind Code:
A1
Abstract:
[Problem] To provide: a heat dissipation structure which is less likely dependent on projections and recesses on the surface of a heat source, has a large contact area with a heat source so as to dissipate heat with high efficiency, and is capable of reducing weight of the heat dissipation structure; a production method therefor; and a battery equipped with said heat dissipation structure. [Solution] This heat dissipation structure 1 enables dissipation of heat from a heat source 10 by conducting heat from the heat source 10 to a cooling member 25, and is provided with: a first sheet 2 that comprises at least one of metal, carbon, and ceramics and that is disposed between the heat source 10 and the cooling member 25; and a second sheet 3 that comprises at least one of metal, carbon and ceramics and that is fixed on a surface, on the side of the heat source 10, of the first sheet 2, and that has a shape in which projections and recesses are continuously repeated in a prescribed direction, wherein the second sheet 3 is provided in such a manner as to form space 4 between the first sheet 2 and the projections and recesses.
Inventors:
SHIMIZU TAKAO (JP)
Application Number:
PCT/JP2019/024082
Publication Date:
December 26, 2019
Filing Date:
June 18, 2019
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
H01M10/6554; H01G2/08; H01G11/18; H01G11/84; H01L23/36; H01M10/613; H01M10/625; H01M10/653; H01M10/6556; H01M10/6561; H01M10/6567; H01M50/209; H01M50/222; H01M50/224; H01M50/231; H05K7/20; H01G2/02; H01G11/12
Domestic Patent References:
| WO2014185271A1 | 2014-11-20 |
Foreign References:
| JP2000236050A | 2000-08-29 | |||
| JP2017195018A | 2017-10-26 |
Attorney, Agent or Firm:
MEBUKI IP LAW FIRM et al. (JP)
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