Title:
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/111709
Kind Code:
A1
Abstract:
The embodiments of the present application provide a heat dissipation apparatus and an electronic device. The heat dissipation apparatus is connected to a radiator. The heat dissipation apparatus comprises a first circuit board, a second circuit board, a support column, a main heat generation component, and a heat conduction assembly. The second circuit board is located at one side of the first circuit board, and is spaced apart from the first circuit board. The support column is connected between the first circuit board and the second circuit board, so as to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The heat conduction assembly is connected between a second heat conduction layer of the first circuit board and a third heat conduction layer of the second circuit board. The heat dissipation apparatus as shown in the present application has a low heat-flow density, a high heat dissipation efficiency and good working reliability.
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Inventors:
LI LAN (CN)
JIN LINFANG (CN)
HU JINYAN (CN)
JIN LINFANG (CN)
HU JINYAN (CN)
Application Number:
PCT/CN2021/134155
Publication Date:
June 02, 2022
Filing Date:
November 29, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN107318236A | 2017-11-03 | |||
| CN210959211U | 2020-07-07 | |||
| CN209643249U | 2019-11-15 | |||
| CN101930952A | 2010-12-29 | |||
| TW201146097A | 2011-12-16 | |||
| CN202011373611A | 2020-11-30 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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