HEAT DISSIPATION CHIP

WIPO Patent Application WO/2021/106620

A1

This heat dissipation chip (130) is used to dissipate heat from a circuit board. The heat dissipation chip (130) comprises: an insulating member (140); and a first electrode (151) and a second electrode (152). The insulating member (130) includes: a first main surface (1411) and a second main surface (1412) having a rectangular parallelepiped shape and facing each other; and a first side surface (1421) to a fourth side surface (1424) connecting the first main surface and the second main surface. The first electrode and the second electrode are formed at opposite ends of the insulating member. In the insulating member, the first side surface (1421) and the second side surface (1422) face each other, and the third side surface (1423) and the fourth side surface (1424) face each other. The first electrode is formed on the entire surface of the first side surface, a part of the first main surface, and a part of the second main surface. The second electrode is formed on the entire surface of the second side surface, a part of the first main surface, and a part of the second main surface. In a plan view of the heat dissipation chip as seen in a normal direction of the third side surface, the first electrode and the second electrode each have a substantially C shape.

JP2008205344	CONDUCTIVE HEAT TRANSFER BOARD, MANUFACTURING METHOD THEREFOR, AND CIRCUIT MODULE USING THE BOARD
JP3120044	Compact image sensor module

YASUTAKE IPPEI (JP)
MIYAWAKI TETSUYA (JP)

PCT/JP2020/042390

June 03, 2021

November 13, 2020

Click for automatic bibliography generation  

ROHM CO LTD (JP)

H01L23/40; H05K1/02; H05K7/20

JP2017204589A	2017-11-16
JPH0582715A	1993-04-02
JP2010267834A	2010-11-25
JP2000003775A	2000-01-07

FUKAMI PATENT OFFICE, P.C. (JP)

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