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Title:
HEAT DISSIPATION DEVICE, CIRCUIT BOARD, AND COMMUNICATION BASE STATION
Document Type and Number:
WIPO Patent Application WO/2023/241580
Kind Code:
A1
Abstract:
Provided in the present application are a heat dissipation device, a circuit board, and a communication base station. The heat dissipation device comprises a substrate (100), a first heat dissipation fin (200) and a second heat dissipation fin (300), wherein the first heat dissipation fin (200) and the second heat dissipation fin (300) are respectively connected to the substrate (100), and a certain included angle (240, 250, 260) can be formed between heat dissipation components (210, 220, 230, 310, 320) of the first heat dissipation fin (200) and the second heat dissipation fin (300).

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Inventors:
LI DECHAO (CN)
ZHOU AILAN (CN)
GUO TIANSHENG (CN)
GUO HONGTAO (CN)
WANG YU (CN)
Application Number:
PCT/CN2023/099955
Publication Date:
December 21, 2023
Filing Date:
June 13, 2023
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20
Domestic Patent References:
WO2019227393A12019-12-05
Foreign References:
CN209390585U2019-09-13
CN101155496A2008-04-02
CN106352249A2017-01-25
CN205158261U2016-04-13
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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