Title:
HEAT DISSIPATION MECHANISM AND DEVICE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2016/170777
Kind Code:
A1
Abstract:
Provided is a heat dissipation mechanism that allows for a smaller device while also facilitating disassembly. The heat dissipation mechanism is provided with a heat dissipation element, which releases heat externally. The heat dissipation element and a heating element that generates heat are in thermal contact with each other via a thermal conduction film formed from a thermally conductive material having the ability to flow, and via a low-friction film having a lower friction coefficient than the heat dissipation element or the heating element.
Inventors:
ARAMAKI CHITOSHI (JP)
HIROSE TARO (JP)
HIROSE TARO (JP)
Application Number:
PCT/JP2016/002107
Publication Date:
October 27, 2016
Filing Date:
April 20, 2016
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01L23/36; H05K7/20
Domestic Patent References:
| WO2015102046A1 | 2015-07-09 |
Foreign References:
| JPH0376147A | 1991-04-02 | |||
| JP2012109604A | 2012-06-07 | |||
| JPH10178132A | 1998-06-30 | |||
| JPH1126968A | 1999-01-29 | |||
| JP2008074683A | 2008-04-03 |
Other References:
See also references of EP 3288359A4
Attorney, Agent or Firm:
SHIMOSAKA, NAOKI (JP)
Naoki Shimosaka (JP)
Naoki Shimosaka (JP)
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