Title:
METHOD FOR APPLYING ADHESIVE, AND JOINED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/170776
Kind Code:
A1
Abstract:
In the present invention, an adhesive is molded in elongated fashion, and an adhesion-preventive treatment is then performed on the surface of the adhesive. The adhesive subjected to the adhesion-preventive treatment is wound and stored until the time of use thereof. The stored adhesive is supplied to a heating member 21 having a discharge hole 21b, heated in the vicinity of the discharge hole 21b and softened or melted, and is discharged from the discharge hole 21b and applied to a joining surface.
Inventors:
MAKIHARA HIROSHI (JP)
YAMADA KOSAKU (JP)
YAMADA KOSAKU (JP)
Application Number:
PCT/JP2016/002098
Publication Date:
October 27, 2016
Filing Date:
April 19, 2016
Export Citation:
Assignee:
HAYAKAWA RUBBER (JP)
International Classes:
B05D7/24; B05D1/26; C09J5/00; C09J121/00
Foreign References:
JPH09500817A | 1997-01-28 | |||
JPS6339977A | 1988-02-20 | |||
JP2000033322A | 2000-02-02 | |||
JP2005036067A | 2005-02-10 | |||
JP2001170545A | 2001-06-26 | |||
JPH0286871A | 1990-03-27 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Download PDF: