HEAT DISSIPATION MEMBER, COOLING DEVICE, AND SEMICONDUCTOR MODULE

WIPO Patent Application WO/2023/181914

A1

This heat dissipation member can be installed on a liquid-cooled jacket, said heat dissipation member comprising: a plate-shaped base part which expands in a first direction running along the direction in which refrigerant flows and a second direction orthogonal to the first direction, and which has a thickness in a third direction orthogonal to the first direction and the second direction; one or a plurality of fin groups arranged so as to be lined up in the first direction, said groups being constituted by a plurality of fins which protrude from the base part toward one side in the third direction and which are arranged in the second direction; and a top panel section provided to end sections of the fins on one side thereof in the third direction. A third-directional gap is provided between the top panel section and the top surface of the liquid-cooled jacket which can be disposed on one side of the top panel section in the third direction. The top panel section has a plurality of first recesses that are arranged so as to be lined up in the first direction and that are recessed toward the other side of the top panel section in the third direction from the surface on the one side thereof in the third direction.

JP2017118050	SEMICONDUCTOR UNIT
JPS5411470	CONSTRUCTION FOR COOLING WIRING BOARD
JP2021103764	HEAT EXCHANGER AND INNER FIN THEREOF

NISHIKAWA KAZUHIRO (JP)
HORI YUTA (JP)
INOUE KENGO (JP)

PCT/JP2023/008578

September 28, 2023

March 07, 2023

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NIDEC CORP (JP)

H01L23/473; H01L23/36; H05K7/20

JP2014135457A	2014-07-24
JP2021168367A	2021-10-21
US6263955B1	2001-07-24
JP2005328012A	2005-11-24
JPH11186762A	1999-07-09
JPH053272A	1993-01-08
JP2022179285A	2022-12-02

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