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Patent Searching and Data


Title:
HEAT DISSIPATION SHEET HAVING HIGH THERMAL CONDUCTIVITY AND HIGH TENSILE STRENGTH, AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/191231
Kind Code:
A1
Abstract:
The present invention relates to a heat dissipation sheet having high thermal conductivity and high tensile strength, and a production method for same, and more specifically relates to a heat dissipation sheet having high thermal conductivity and high tensile strength in which the size and amount of inorganic particles included have been adjusted to a specific range, thus the heat dissipation sheet has high thermal conductivity and excellent tensile strength, and a production method for same.

Inventors:
CHOI HYUN SEOK (KR)
PARK JEONG HYUN (KR)
HAN SANG HYO (KR)
Application Number:
PCT/KR2022/018165
Publication Date:
October 05, 2023
Filing Date:
November 17, 2022
Export Citation:
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Assignee:
SMT CORP (KR)
International Classes:
H05K7/20; B32B7/022; H01L23/373
Foreign References:
KR101828515B12018-02-12
KR101271965B12013-06-07
KR20090074772A2009-07-07
KR20150120765A2015-10-28
KR101436468B12014-09-01
Attorney, Agent or Firm:
KANGIN PATENT LAW FIRM (KR)
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