Title:
HEAT DISSIPATION STRUCTURE AND ELECTRONIC TERMINAL
Document Type and Number:
WIPO Patent Application WO/2022/021736
Kind Code:
A1
Abstract:
A heat dissipation structure (100) and an electronic terminal (1000). The heat dissipation structure (100) comprises a function component (10), a first heat-conducting layer (20), and a heat dissipation plate (30). The function component (10) comprises an electronic device (11) and a circuit board (12), the circuit board (12) comprises a first surface (121) and a second surface (122) that are opposite to one another, the electronic device (11) is disposed on at least one surface among the first surface (121) and the second surface (122), and the electronic device (11) comprises a heating device. The first heat-conducting layer (20) is disposed on the second surface (122), and the first heat-conducting layer (20) is basically attached to the second surface (122). The first heat-conducting layer (20) is connected to the heat dissipation plate (30) and the circuit board (12), and the heat dissipation plate (30) is used to enable the heat of the function component (10) that is conducted by passing through the first heat-conducting layer (20) to dissipate.
Inventors:
SONG CHUANG (CN)
Application Number:
PCT/CN2020/135387
Publication Date:
February 03, 2022
Filing Date:
December 10, 2020
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN110235059A | 2019-09-13 | |||
| CN106647114A | 2017-05-10 | |||
| CN208046752U | 2018-11-02 | |||
| US20190285970A1 | 2019-09-19 |
Attorney, Agent or Firm:
BEIJING LISENG INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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