Title:
HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/168874
Kind Code:
A1
Abstract:
A heat dissipation structure, which is used for dissipating the heat of a heating electronic component, comprising a heat pipe one end of which is connected to the electronic component, wherein the heat pipe comprises an evaporation section close to the electronic component and a condensation section far away from the electronic component; and further comprising a thermoelectric refrigeration device one end of which is connected to the electronic component and/or the heat pipe, wherein the thermoelectric refrigeration device has a heat absorption end connected to the electronic component and/or the heat pipe and a heat dissipation end far away from the electronic component and/or the heat pipe. On one hand, the working fluid in the heat pipe may dissipate the heat of heating electronic components by means of an evaporation-condensation cycle. On the other hand, the thermoelectric refrigeration device may actively cool down the electronic component or the heat pipe connected to the heat absorption end, thereby improving the heat dissipation efficiency.
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Inventors:
FANG WENBING (CN)
XU SHASHA (CN)
CHEN XIAOJIE (CN)
LI FUGEN (CN)
XU SHASHA (CN)
CHEN XIAOJIE (CN)
LI FUGEN (CN)
Application Number:
PCT/CN2020/077585
Publication Date:
September 02, 2021
Filing Date:
March 03, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (SG)
AAC TECHNOLOGIES PTE LTD (SG)
International Classes:
H05K7/20
Foreign References:
| CN208547905U | 2019-02-26 | |||
| CN102128518A | 2011-07-20 | |||
| US20090086433A1 | 2009-04-02 | |||
| CN102401506A | 2012-04-04 | |||
| CN106793669A | 2017-05-31 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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