HEAT DISSIPATION STRUCTURE

WIPO Patent Application WO/2022/188879

A1

Provided is a heat dissipation structure, belonging to the technical field of the heat dissipation of power modules. The heat dissipation structure comprises: a heat dissipation plate (10), wherein the heat dissipation plate (10) is provided with a first side and a second side which are arranged in the thickness direction, the first side of the heat dissipation plate (10) is used for being attached to a member on which heat is to be dissipated, and the second side of the heat dissipation plate (10) is provided with an accommodating groove (11); and a water pipe (20), which is in interference fit with the accommodating groove (11), wherein at least part of an outer wall of the water pipe (20) is attached to a groove wall of the accommodating groove (11). By means of interference fitting of the water pipe with the accommodating groove, there is no need to use a heat conducting adhesive for bonding, so that not only can the stable connection between the water pipe and the heat dissipation plate be ensured, thereby preventing the water pipe from falling off of same, but the outer wall of the water pipe can also be attached to the groove wall of the accommodating groove to the greatest possible extent, thereby improving the heat dissipation efficiency.

JP2020020518	EVAPORATOR, LOOP TYPE HEAT PIPE, COOLING DEVICE, AND ELECTRONIC APPARATUS
JP4912237	Electrical equipment storage box

DONG TIANYUAN (CN)
JIN YING (CN)
BAI YUFENG (CN)

PCT/CN2022/080448

September 15, 2022

March 11, 2022

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SHANGHAI VALEO AUTOMOTIVE ELECTRICAL SYSTEMS CO LTD (CN)

H05K7/20

CN112865440A	2021-05-28
CN113015418A	2021-06-22
CN106455430A	2017-02-22
CN211509705U	2020-09-15
US5812372A	1998-09-22

BEIJING JINCHENGTONGDA & NEAL LAW FIRM (CN)

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