Title:
HEAT DISSIPATION SUBSTRATE AND HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/085050
Kind Code:
A1
Abstract:
This heat dissipation substrate comprises a base body containing a carbon material, and a plurality of pipe mounting parts positioned on the base body. When the direction in which the plurality of pipe mounting parts are aligned is defined as the X direction, the direction in which the plurality of pipe mounting parts extends is defined as the Y direction, the plane extending in the X direction and the Y direction is defined as the XY plane, and a direction intersecting the XY plane is defined as the Z direction, the thermal conductivity in the Z direction of the substrate is higher than the thermal conductivity in at least one direction along the XY plane of the substrate.
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Inventors:
MIYAMOTO TAKASHI (JP)
Application Number:
PCT/JP2023/036972
Publication Date:
April 25, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/36; F28D15/02; H01L23/427; H05K7/20
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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