Title:
HEAT DISSIPATION SUBSTRATE AND HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/085051
Kind Code:
A1
Abstract:
A heat dissipation substrate comprising: a base body that contains a carbon material; a cover member that is positioned on the outer surface of the base body; and a pipe mounting part that is a groove or a through hole positioned across the base body and the cover member.
Inventors:
MIYAMOTO TAKASHI (JP)
NISHIMOTO KAZUKI (JP)
NISHIMOTO KAZUKI (JP)
Application Number:
PCT/JP2023/036982
Publication Date:
April 25, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/36; H05K7/20
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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