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Patent Searching and Data


Title:
HEAT DISSIPATOR AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/226445
Kind Code:
A1
Abstract:
Disclosed in the present application are a heat dissipator and a communication device. The heat dissipator comprises a heat dissipation substrate (110), at least two heat dissipation fins (120), and at least one strip-shaped heat dissipation cover (130). The heat dissipation fins (120) are obliquely arranged on the heat dissipation substrate (110); a heat dissipation channel (123) is formed between every two adjacent heat dissipation fins (120); each heat dissipation fin (120) is provided with at least one top notch (121); and each heat dissipation cover (130) is connected to the top notches (121) in two heat dissipation fins (120).

Inventors:
WANG YAN (CN)
LIU XIN (CN)
NIE ZHIDONG (CN)
LIU FAN (CN)
LI SHUAI (CN)
DUAN KAIWEN (CN)
Application Number:
PCT/CN2023/070695
Publication Date:
November 30, 2023
Filing Date:
January 05, 2023
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20
Foreign References:
CN210725817U2020-06-09
CN209710561U2019-11-29
CN113543575A2021-10-22
CN206118266U2017-04-19
CN206976321U2018-02-06
JP2001110958A2001-04-20
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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