Title:
HEAT EXCHANGE SYSTEM FOR SEMICONDUCTOR COOLING SHEET
Document Type and Number:
WIPO Patent Application WO/2024/002183
Kind Code:
A1
Abstract:
Disclosed in the present utility model is a heat exchange system for a semiconductor cooling sheet, comprising: a heat exchange base, a gas pipe, a condenser, a liquid pipe and a heat dissipation fan. The heat exchange base is in close contact with the hot surface of the semiconductor cooling sheet; the heat exchange base is provided with a closed heat absorption cavity; a liquid refrigerant is stored in the heat absorption cavity; the condenser is inclinedly or vertically placed, and is located above the heat exchange base; the heat absorption cavity is communicated with an air inlet in the upper end of the condenser by means of the gas pipe; a liquid outlet in the lower end of the condenser is communicated with the heat absorption cavity by means of the liquid pipe; and the heat dissipation fan is located on one side of the condenser. The heat exchange system for the semiconductor cooling sheet has high heat exchange efficiency, such that the heat dissipation requirement of the semiconductor cooling sheet can be effectively met.
Inventors:
WANG YIFENG (CN)
WEI SHIPENG (CN)
LIANG ZHITAO (CN)
WEI SHIPENG (CN)
LIANG ZHITAO (CN)
Application Number:
PCT/CN2023/103311
Publication Date:
January 04, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
LAIRD THERMAL SYSTEMS SHENZHEN LTD (CN)
International Classes:
F25B21/00
Domestic Patent References:
| WO2021248901A1 | 2021-12-16 |
Foreign References:
| CN217952747U | 2022-12-02 | |||
| CN203561014U | 2014-04-23 | |||
| CN101344344A | 2009-01-14 | |||
| CN113423237A | 2021-09-21 | |||
| CN203561013U | 2014-04-23 | |||
| CN208655616U | 2019-03-26 | |||
| US20090000332A1 | 2009-01-01 |
Attorney, Agent or Firm:
HAIHONG JIACHENG INTELLECTUAL PROPERTY & PARTNERS (CN)
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