Title:
HEAT INSULATING SHEET
Document Type and Number:
WIPO Patent Application WO/2023/190569
Kind Code:
A1
Abstract:
A heat insulating sheet according to the present invention comprises one or more first dust generation layers that generate dust when an external force is applied and a packaging material layer that is formed of a packaging film and covers the one or more first dust generation layers, and the heat insulating sheet satisfies formula (1). (In the formula, A is the Young's modulus (MPa) of the packaging film, B is the breaking strength (MPa) of the packaging film, C is the elongation at break (%) of the packaging film, D is the tensile strength (MPa) applied to the packaging film at the time of compression, F is the area (m2) of a heat insulating material including the first dust generation layer, G is the nitrogen permeability (cm3/(m2·day·MPa)) of the packaging film, H is the air permeability (cm3/(cm2·s)) of a vent of the packaging material layer, I is the area (cm2) of the vent, and J is the thickness (mm) of the heat insulating material).
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Inventors:
SASAKI SHU (JP)
UI TAKEHIRO (JP)
UI TAKEHIRO (JP)
Application Number:
PCT/JP2023/012622
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
F16L59/02; F16L59/10
Domestic Patent References:
| WO2021117336A1 | 2021-06-17 | |||
| WO2017221687A1 | 2017-12-28 |
Foreign References:
| US20080057334A1 | 2008-03-06 | |||
| JPH10512349A | 1998-11-24 | |||
| JP2009299893A | 2009-12-24 | |||
| US20190292348A1 | 2019-09-26 | |||
| JPH09241618A | 1997-09-16 | |||
| JP2000336793A | 2000-12-05 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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