Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/146848
Kind Code:
A1
Abstract:
In this heat pump device, a discharge port of a first compression mechanism unit of a first compressor is connected to a refrigerant space of a second sealed container through first discharge piping. Refrigerant spaces of a first sealed container of the first compressor and the second sealed container communicate with each other via a refrigerant communication pipe, and oil storage spaces of the containers communicate with each other via an oil communication pipe. Refrigerant compressed with the first compression mechanism unit of the first compressor flows into the second sealed container via the first discharge piping and then is sent to a condenser via refrigerant piping and the first sealed container of the first compressor.
Inventors:
KITAGAWA HIDEAKI (JP)
MOROE SHOGO (JP)
KAKUDA MASAYUKI (JP)
KAWAMURA RAITO (JP)
SEKIYA SHIN (JP)
NAKAO HIDETO (JP)
MOROE SHOGO (JP)
KAKUDA MASAYUKI (JP)
KAWAMURA RAITO (JP)
SEKIYA SHIN (JP)
NAKAO HIDETO (JP)
Application Number:
PCT/JP2017/033188
Publication Date:
August 16, 2018
Filing Date:
September 14, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00; F25B31/00; F25B43/02
Foreign References:
| JP2016031183A | 2016-03-07 | |||
| JP2011047535A | 2011-03-10 | |||
| JP2005312272A | 2005-11-04 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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