Title:
HEAT-RESISTANT ELECTRET MATERIAL AND CONDENSER MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2013/011949
Kind Code:
A1
Abstract:
Provided is a heat-resistant electret material with which charge retention is large, charge attenuation is small, and bonding between a metallic substrate and an electret layer formed from a fluorine resin, particularly polytetrafluoroethylene (PTFE), is superior. A heat-resistant electret material (10) comprises, upon a metallic substrate (1), an electret (3) which is formed from a fluorine resin, with a grounding resin layer (2) therebetween including a fluorine resin, silicon and/or a silicon compound, and conductive carbon. By introducing highly metallophilic silicon and/or a compound thereof into the grounding resin layer in a range which does not impair the electret material charge retention characteristics thereof, it is possible to improve adhesion between the metallic substrate, the grounding resin layer, and the electret layer.
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Inventors:
SHIRAKAWA TOMOYUKI (JP)
NAGAO HIROYUKI (JP)
NAGAO HIROYUKI (JP)
Application Number:
PCT/JP2012/067953
Publication Date:
January 24, 2013
Filing Date:
July 13, 2012
Export Citation:
Assignee:
MITSUBISHI PLASTICS INC (JP)
SHIRAKAWA TOMOYUKI (JP)
NAGAO HIROYUKI (JP)
SHIRAKAWA TOMOYUKI (JP)
NAGAO HIROYUKI (JP)
International Classes:
H01G7/02; H04R19/01; H04R19/04
Domestic Patent References:
| WO2009128503A1 | 2009-10-22 |
Foreign References:
| JP2010279024A | 2010-12-09 | |||
| JP2005262497A | 2005-09-29 |
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi (JP)
Takeshi Shigeno (JP)
Takeshi Shigeno (JP)
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Claims: