Title:
HEAT-RESISTANT THERMALLY CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2004/067606
Kind Code:
A1
Abstract:
A heat-resistant thermally conductive material which comprises an organic-inorganic hybrid material which is prepared by heating a sol containing an alkoxide of a metal or a semimetal, an organic silicon compound and a good thermally conductive material to allow the sol to gelate. The organic-inorganic hybrid material exhibits excellent releasability and is less susceptible to adhesion of dust, toner or the like and is easy to remove the dust, a toner or the like even when it has been adhered thereto, and the good thermally conductive material imparts good heat radiating property to the organic-inorganic hybrid material, and thus the heat-resistant thermally conductive material is less susceptible to adhesion of a fine powder such as dust or a toner and exhibits good heat radiating property.
Inventors:
SHINDO TAKUYA (JP)
Application Number:
PCT/JP2004/000007
Publication Date:
August 12, 2004
Filing Date:
January 05, 2004
Export Citation:
Assignee:
FUJI XEROX SUZUKA (JP)
SHINDO TAKUYA (JP)
SHINDO TAKUYA (JP)
International Classes:
C08K3/00; C08G77/398; C08G79/00; C08K5/057; C08K5/5419; C08L83/06; C08L85/00; (IPC1-7): C08G79/00; C08G77/398; C08K3/00; C08K5/057; C08L83/06; C08L85/00
Foreign References:
| JPH10245490A | 1998-09-14 | |||
| JP2000038508A | 2000-02-08 | |||
| JPH07278311A | 1995-10-24 | |||
| JPS6381176A | 1988-04-12 |
Attorney, Agent or Firm:
Usami, Tadao (32 Tsukimigaoka, Yatomi-cho, Mizuho-k, Nagoya-shi Aichi, JP)
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