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Title:
HEAT-SEALABLE RESIN COMPOSITION, HEAT SEAL MATERIAL, PACKAGING MATERIAL, LID MATERIAL, AND PACKAGING CONTAINER
Document Type and Number:
WIPO Patent Application WO/2022/196298
Kind Code:
A1
Abstract:
A heat-sealable resin composition including an ethylene-vinyl ester copolymer (A) and a tackifying resin (B), in which the content of a constituent unit derived from the vinyl ester included in the ethylene-vinyl ester copolymer (A) with respect to the total constituent units of the copolymer constituting the ethylene-vinyl ester copolymer (A) is 8 mass% or more, and the tackifying resin (B) includes an alicyclic hydrocarbon resin (B1) and an aromatic hydrocarbon resin (B2).

Inventors:
NISHIJIMA KOICHI (JP)
NAKANO SHIGENORI (JP)
SAKUMA MASAMI (JP)
TAKAOKA HIROKI (JP)
Application Number:
PCT/JP2022/007991
Publication Date:
September 22, 2022
Filing Date:
February 25, 2022
Export Citation:
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Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
C08L23/08; B65D65/40; C08L25/02; C08L45/00; C09J7/35; C09J11/08; C09J123/08
Domestic Patent References:
WO2020196673A12020-10-01
Foreign References:
JP2011511866A2011-04-14
JP2016528333A2016-09-15
JP2017132851A2017-08-03
JP2017149850A2017-08-31
JP2013018826A2013-01-31
JP2001123135A2001-05-08
JP2018076398A2018-05-17
JP2017132851A2017-08-03
JP2017149850A2017-08-31
JP2021044951A2021-03-18
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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