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Title:
HEAT SEALING RESIN COMPOSITION, HEAT SEALABLE MATERIAL, PACKAGING MATERIAL, COVER MATERIAL AND PACKAGING CONTAINER
Document Type and Number:
WIPO Patent Application WO/2022/196297
Kind Code:
A1
Abstract:
A heat sealing resin composition which contains an ethylene-vinyl ester copolymer (A), an ethylene-unsaturated carboxylic acid ester copolymer (B) and a tackifying resin (C), wherein: the content of a constituent unit derived from a vinyl ester in the ethylene-vinyl ester copolymer (A) is 8% by mass or more relative to all constituent units of copolymers that constitute the ethylene-vinyl ester copolymer (A); and the tackifying resin (C) contains an alicyclic hydrocarbon resin (C1) and an aromatic hydrocarbon resin (C2).

Inventors:
NISHIJIMA KOICHI (JP)
NAKANO SHIGENORI (JP)
SAKUMA MASAMI (JP)
TAKAOKA HIROKI (JP)
Application Number:
PCT/JP2022/007990
Publication Date:
September 22, 2022
Filing Date:
February 25, 2022
Export Citation:
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Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
C08L23/08; B65D65/40
Domestic Patent References:
WO2020110829A12020-06-04
WO2020196673A12020-10-01
Foreign References:
JP2020094144A2020-06-18
JP2012188133A2012-10-04
JP2002294996A2002-10-09
JP2013018826A2013-01-31
JP2001123135A2001-05-08
JP2018076398A2018-05-17
JP2017132851A2017-08-03
JP2017149850A2017-08-31
JP2021044950A2021-03-18
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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