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Patent Searching and Data


Title:
HEAT-SENSITIVE RECORDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/195511
Kind Code:
A1
Abstract:
The present disclosure provides a heat-sensitive recording material which sequentially comprises, on a supporting body in the following order, at least a primer coating layer that contains an inorganic pigment, hollow particles and an adhesive, and a heat-sensitive recording layer that contains a leuco dye, a color developer and an adhesive, and which is characterized in that: a fist color developer and a second color developer are contained as the color developer; and an N,N'-diaryl urea compound represented by general formula (1) is contained as the second color developer. (In the formula, each R2 moiety represents an alkyl group having 1 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; the aralkyl group and the aryl group may be substituted by an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, or a halogen atom; the plurality of R2 moieties may be the same as or different from each other; each A1 moiety represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and the plurality of A1 moieties may be the same as or different from each other.)

Inventors:
TAKEMURA TAKASHI (JP)
SUGIYAMA NAONOBU (JP)
Application Number:
PCT/JP2023/014184
Publication Date:
October 12, 2023
Filing Date:
April 06, 2023
Export Citation:
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Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
B41M5/40; B41M5/333; B41M5/42; B41M5/44
Domestic Patent References:
WO2014181746A12014-11-13
WO2020004558A12020-01-02
Foreign References:
JP2019043005A2019-03-22
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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