Title:
HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/234660
Kind Code:
A1
Abstract:
The present invention relates to a heat sink structure and a manufacturing method thereof, which fix, through laser welding, a plurality of radiation fin portions radiating heat at a radiation surface of a heat sink body portion, so as to minimize the thickness and gaps of the plurality of radiation fin portions, thereby improving radiation performance, allows for remarkably reduced weight, and greatly decreases production lead time and manufacturing costs since only the heat sink body portion is manufactured through casting.
More Like This:
| WO/2005/024941 | SEMICONDUCTOR DEVICE |
| WO/2015/104715 | DISSIPATING HEAT FROM ELECTRONIC DEVICES |
| JPS57164566 | SEMICONDUCTOR DEVICE |
Inventors:
KIM DUK YONG (KR)
JI KYO SUNG (KR)
KIM DONG WON (KR)
HAN KYU TAE (KR)
LEE HWANG JU (KR)
CHOI IN HWA (KR)
JI KYO SUNG (KR)
KIM DONG WON (KR)
HAN KYU TAE (KR)
LEE HWANG JU (KR)
CHOI IN HWA (KR)
Application Number:
PCT/KR2023/007335
Publication Date:
December 07, 2023
Filing Date:
May 30, 2023
Export Citation:
Assignee:
KMW INC (KR)
International Classes:
H01L23/367; H05K7/20
Foreign References:
| JP2018190847A | 2018-11-29 | |||
| KR20110010537U | 2011-11-10 | |||
| JPH11290974A | 1999-10-26 | |||
| JP2021170592A | 2021-10-28 | |||
| KR900001786A | 1990-02-27 |
Attorney, Agent or Firm:
SUAN INTELLECTUAL PROPERTY (KR)
Download PDF: