Title:
HEAT TRANSFER SHEET, METHOD FOR PRODUCING HEAT TRANSFER SHEET, HEAT DISSIPATION COMPONENT AND METHOD FOR PRODUCING HEAT DISSIPATION COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/157476
Kind Code:
A1
Abstract:
The present invention provides a heat transfer sheet which is used by being interposed between an electronic component and a heat dissipation body, and which comprises: a heat transfer sheet main body that contains a thermally conductive filler; a first adhesive layer that is arranged so as to be in contact with the entirety of a first surface of the heat transfer sheet main body; a second adhesive layer that is arranged so as to be in contact with a part of a second surface of the heat transfer sheet main body, said second surface being on the reverse side of the first surface; a first release film that is arranged so as to be in contact with a surface of the first adhesive layer, said surface being on the reverse side of the heat transfer sheet main body-side surface; and a second release film that is arranged so as to be in contact with a surface of the second adhesive layer, said surface being on the reverse side of the heat transfer sheet main body-side surface.
Inventors:
ARAMAKI KEISUKE (JP)
OHTA EIJI (JP)
KUBO YUSUKE (JP)
MUKASA KEISUKE (JP)
OHTA EIJI (JP)
KUBO YUSUKE (JP)
MUKASA KEISUKE (JP)
Application Number:
PCT/JP2021/003230
Publication Date:
August 12, 2021
Filing Date:
January 29, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B27/00; B32B7/027; B32B27/20; C09J7/25; C09J7/38; C09J133/00; C09J201/00; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| WO2019212051A1 | 2019-11-07 |
Foreign References:
| JPH06163762A | 1994-06-10 | |||
| JP2010093077A | 2010-04-22 | |||
| JP2020013872A | 2020-01-23 | |||
| JP2010024371A | 2010-02-04 |
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
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