Title:
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET, HEAT-DISSIPATING COMPONENT, AND METHOD FOR MANUFACTURING HEAT-DISSIPATING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/157477
Kind Code:
A1
Abstract:
Provided is a thermally conductive sheet having: a thermally conductive sheet body containing a thermally conductive filler, the thermally conductive sheet body being used so as to be interposed between an electronic component and a heat-dissipating body; a pressure-sensitive adhesive layer arranged so as to be in contact with the entirety of a first surface of the thermally conductive sheet body; a peelable film arranged so as to be in contact with the surface of the pressure-sensitive adhesive layer that is on the opposite side from the thermally-conductive-sheet-side surface; and a peelable protective film arranged so as to be in contact with the entirety of a second surface of the thermally conductive sheet body, the second surface being on the opposite side from the first surface.
Inventors:
ARAMAKI KEISUKE (JP)
OHTA EIJI (JP)
KUBO YUSUKE (JP)
MUKASA KEISUKE (JP)
OHTA EIJI (JP)
KUBO YUSUKE (JP)
MUKASA KEISUKE (JP)
Application Number:
PCT/JP2021/003231
Publication Date:
August 12, 2021
Filing Date:
January 29, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B7/027; B32B27/00; B32B27/18; C09J7/25; C09J7/38; C09J201/00; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| WO2019212051A1 | 2019-11-07 |
Foreign References:
| JP2020013871A | 2020-01-23 | |||
| JP2010093077A | 2010-04-22 | |||
| JP2010024371A | 2010-02-04 | |||
| JPH06163762A | 1994-06-10 |
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
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