Title:
HEATER CHIP AND HEATER CHIP UNIT
Document Type and Number:
WIPO Patent Application WO/2022/054419
Kind Code:
A1
Abstract:
This heater chip and this heater chip unit can easily achieve good heating efficiency regardless of increases or decreases in plate thickness. The heater chip is a plate-shaped heater chip 2 for thermal press fitting of a terminal lead to a terminal member, and comprises: a soldering iron section 6 provided with a soldering iron tip section 13 that comes into contact with the terminal lead in a state of protruding downward from a soldering iron body 11; and connecting arm sections 7 that extend upward from lateral end sections of the soldering iron body 11 and raise the temperature of the soldering iron section 6 by causing a current from a power source to flow to the soldering iron body 11. The soldering iron body 11 has: a plate thickness that is set to be less than that of the connecting arm sections 7; and a cross-sectional area that is set to be less than that of the connecting arm sections 7.
More Like This:
Inventors:
SUGA SHINICHIRO (JP)
Application Number:
PCT/JP2021/027194
Publication Date:
March 17, 2022
Filing Date:
July 20, 2021
Export Citation:
Assignee:
APOLLO GIKEN CO LTD (JP)
International Classes:
B23K20/00; H01F41/10; H01R4/02; H05B3/10
Domestic Patent References:
| WO2017038282A1 | 2017-03-09 |
Foreign References:
| JPS586773A | 1983-01-14 |
Attorney, Agent or Firm:
KAWANO Hiroshi (JP)
Download PDF: