Title:
HEATER CHIP UNIT
Document Type and Number:
WIPO Patent Application WO/2022/054420
Kind Code:
A1
Abstract:
The present invention is a heater chip unit with which inconvenience caused due to inadvertent catching on a lead of a temperature sensor is not prone to occur. Specifically, the present invention is a heater chip unit 1 with a thermocouple 3 attached to a plate-shaped heater chip 2 for thermal press fitting of a terminal lead to a terminal member, wherein: the heater chip 2 is provided with a soldering iron section 6, in which a soldering iron tip section 13 that comes into contact with the terminal lead is provided on a soldering iron body 11, and a pair of connecting arm sections 7 that extend upward from lateral end sections of the soldering iron body 11 in a mutually separated state and that raise the temperature of the soldering iron section 6 by causing a current from a power source to flow to the soldering iron body 11; a gap between the connecting arm sections 7 serves as a lead housing space section 30 with an upper-end portion open; and a lead 3b of the thermocouple 3 is housed within this lead housing space section 30.
More Like This:
Inventors:
SUGA SHINICHIRO (JP)
Application Number:
PCT/JP2021/027195
Publication Date:
March 17, 2022
Filing Date:
July 20, 2021
Export Citation:
Assignee:
APOLLO GIKEN CO LTD (JP)
International Classes:
B23K20/00; B23K3/04
Foreign References:
| JP2005066636A | 2005-03-17 | |||
| JP2004296358A | 2004-10-21 |
Attorney, Agent or Firm:
KAWANO Hiroshi (JP)
Download PDF: