HEATING ASSEMBLY, ATOMIZER, AND ELECTRONIC ATOMIZATION DEVICE

WIPO Patent Application WO/2022/160961

A1

A heating assembly, an atomizer and an electronic atomization device. The heating assembly comprises a porous base body (1) for absorbing a liquid medium, and a heating body (2) located on an atomization surface (11) of the porous base body (1) for heating and atomizing the liquid medium absorbed in the porous base body (1), wherein the minimum distance value L1 between an edge of the heating body (2) and an edge of the atomization surface (11) is configured such that the side temperature of the porous base body (1) when the heating body (2) is in a working state is below 105°C; and the ratio of the minimum distance value L1 between the edge of the heating body (2) and the edge of the atomization surface (11) to the minimum width value L2 of the atomization surface (11) is greater than 15.6%. During heating by the heating body (2), the temperature of the side edge of the porous base body (1) is decreased, which solves the problem of unsmooth gas exchange due to the deformation of a heating base on the side edge of the porous base body (1) caused by excess temperature, and also, the vapor generation amount of the heating assembly is increased.

XIANG SHAOBIN (CN)
CHEN ZHICHAO (CN)
JIANG RU (CN)
JIANG YUE (CN)

PCT/CN2021/136558

August 04, 2022

December 08, 2021

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SHENZHEN SMOORE TECHNOLOGY LTD (CN)

A24F47/00; A61M11/00; A61M15/06

WO2020228330A1

2020-11-19

CN110384258A	2019-10-29
CN210382633U	2020-04-24
CN111436664A	2020-07-24
CN110301674A	2019-10-08
CN109414078A	2019-03-01
US20130068856A1	2013-03-21

SUNSHINE INTELLECTUAL PROPERTY INTERNATIONAL CO., LTD. (CN)

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