Title:
HEATING DEVICE FOR HOT STAMPING
Document Type and Number:
WIPO Patent Application WO/2014/109241
Kind Code:
A1
Abstract:
A heating device (1) for hot stamping is designed to heat a plated metallic material (9) while conveying the metallic material, and is provided with a first heating bath (3A) provided in a conveyance path (2) for the metallic material, and a second heating bath (3B) provided on the downstream side from the first heating bath in the conveyance path, the amount of heating by the second heating bath is set such that the temperature of the metallic material becomes an Ac3 point or more and less than the boiling point of the plating, and the amount of heating by the first heating bath is set larger than the amount of heating by the second heating bath.
Inventors:
KAMIYA YOSHIHIRO (JP)
Application Number:
PCT/JP2013/084861
Publication Date:
July 17, 2014
Filing Date:
December 26, 2013
Export Citation:
Assignee:
FUTABA IND CO LTD (JP)
International Classes:
B21D24/00; B21D22/20; C21D1/18; C21D9/00
Domestic Patent References:
| WO2012026442A1 | 2012-03-01 |
Foreign References:
| JPH11256235A | 1999-09-21 | |||
| JP2009176584A | 2009-08-06 |
Other References:
See also references of EP 2944393A4
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (JP)
Nagoya international patent business corporation (JP)
Nagoya international patent business corporation (JP)
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