Title:
HOT-STAMPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/109242
Kind Code:
A1
Abstract:
This hot-stamping device (1) is a hot-stamping device for hot stamping a metal material (9) coated with a Zn-Ni plating, and is equipped with: a first die (21); a movable body (33) capable of relative movement toward and away from the first die; a second die (31) for working in conjunction with the first die and performing a first molding of the metal material, and supported by the movable body; a third die (32) for working in conjunction with the first die and performing a second molding of the metal material, and supported by the movable body; and a switching device (34) capable of switching the relative position of the third die in relation to the second die in the toward-away direction.
Inventors:
TANAKA YOSHIKI (JP)
NAKASHIMA SEIKI (JP)
NAKANE SHINICHIRO (JP)
MINOURA HIROKI (JP)
NAKASHIMA SEIKI (JP)
NAKANE SHINICHIRO (JP)
MINOURA HIROKI (JP)
Application Number:
PCT/JP2013/084862
Publication Date:
July 17, 2014
Filing Date:
December 26, 2013
Export Citation:
Assignee:
FUTABA IND CO LTD (JP)
International Classes:
B21D24/00; B21D22/20
Domestic Patent References:
| WO2012121399A1 | 2012-09-13 |
Foreign References:
| JP2011092946A | 2011-05-12 | |||
| JP2011230189A | 2011-11-17 | |||
| JP2000158057A | 2000-06-13 | |||
| JPS56117929U | 1981-09-09 | |||
| JPH0248216U | 1990-04-03 |
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (JP)
Nagoya international patent business corporation (JP)
Nagoya international patent business corporation (JP)
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