Title:
HEATING PROCESSING DEVICE AND METHOD FOR OPERATING SAME
Document Type and Number:
WIPO Patent Application WO/2023/210656
Kind Code:
A1
Abstract:
This heating processing device comprises: a semiconductor substrate; a carbon susceptor on which the semiconductor substrate is placed; a first heating device; an optical system for collecting and irradiating light output from the first heating device onto a surface of the semiconductor substrate; and a second heating device which is disposed opposite the semiconductor substrate across the carbon susceptor, and is spaced apart from the carbon susceptor. The second heating device heats the semiconductor substrate to a first temperature, and the first heating device heats the semiconductor substrate to a second temperature higher than the first temperature by collecting and irradiating light by means of the optical system.
Inventors:
TAKAMURA MAKOTO (JP)
SATO KEIJU (JP)
SATO KEIJU (JP)
Application Number:
PCT/JP2023/016343
Publication Date:
November 02, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/26; H01L21/324
Foreign References:
| JP2007180533A | 2007-07-12 | |||
| JPH03116828A | 1991-05-17 | |||
| JP2001110738A | 2001-04-20 | |||
| JPH06291069A | 1994-10-18 | |||
| JP2000349038A | 2000-12-15 | |||
| JP2014241387A | 2014-12-25 | |||
| JPH1197370A | 1999-04-09 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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