Title:
HEATSINK MEMBER AND ELECTRONIC DEVICE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2020/158739
Kind Code:
A1
Abstract:
A heatsink member of the present disclosure comprises: an insulating first wall portion; a second wall portion positioned opposite the first wall portion; a third wall portion positioned between the first wall portion and the second wall portion; a flow path surrounded by the first wall portion, the second wall portion, and the third wall portion; an electrically conductive layer positioned on an outer surface of the first wall portion; and a first metal layer which is positioned on an inner surface of the first wall portion and has gaps. An electronic device of the present disclosure comprises a heatsink member having the above-described configuration, and an electronic component positioned on the electrically conductive layer of the heatsink member.
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Inventors:
MUNEISHI TAKESHI (JP)
Application Number:
PCT/JP2020/003000
Publication Date:
August 06, 2020
Filing Date:
January 28, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| WO2017104830A1 | 2017-06-22 | |||
| WO2015147071A1 | 2015-10-01 |
Foreign References:
| JP2005032881A | 2005-02-03 | |||
| JPH0483368A | 1992-03-17 | |||
| JP2006165165A | 2006-06-22 | |||
| JP2002093975A | 2002-03-29 |
Other References:
See also references of EP 3920217A4
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