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Title:
HEATSINK MODULE
Document Type and Number:
WIPO Patent Application WO/2019/131589
Kind Code:
A1
Abstract:
This heatsink module is provided with: a container having an evaporation part in which a working fluid is sealed inside and the working fluid is evaporated; a condensation part that condenses the evaporated working fluid; and a wick that is in contact with each of a pair of opposing inner wall surfaces of the container and that moves the condensed working fluid by capillary action from the condensation part to the evaporation part. A liquid reservoir flow channel for the condensed working fluid is formed in a space enclosed by: the pair of inner wall surfaces; a working surface, of the wick, that extends in the opposing direction in which the pair of inner wall surfaces oppose each other; and an opposing surface that is formed with a gap from the working surface.

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Inventors:
YOKOYAMA YUICHI (JP)
KAWAHARA YOUJI (JP)
SAITO YUJI (JP)
Application Number:
PCT/JP2018/047468
Publication Date:
July 04, 2019
Filing Date:
December 25, 2018
Export Citation:
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Assignee:
FUJIKURA LTD (JP)
International Classes:
F28D15/02; F28D15/04
Foreign References:
JP2014120516A2014-06-30
JP2011043320A2011-03-03
JP2001108384A2001-04-20
JPS61153384A1986-07-12
JPH0482560U1992-07-17
JP2004198096A2004-07-15
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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