HIGH CONDUCTIVITY INKS WITH LOW MINIMUM CURING TEMPERATURES

Title:

HIGH CONDUCTIVITY INKS WITH LOW MINIMUM CURING TEMPERATURES

Document Type and Number:

WIPO Patent Application WO2004067647

Kind Code:

A8

Abstract:

Conductive ink compositions which can be cured to highly conductive metal traces by means of "chemical welding" include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.

Inventors:

CONAGHAN BRIAN F
KYDD PAUL H
RICHARD DAVID L

Application Number:

PCT/US2004/002313

Publication Date:

March 10, 2005

Filing Date:

January 27, 2004

Export Citation:

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Assignee:

PARELEC INC (US)

International Classes:

C09D11/00; H01B1/22; H05K1/09; (IPC1-7): C09D5/02; B05D5/12; H01B1/02; H01L21/00

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